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  • PCB FPC Laser Separator PCB Punch Depanel Machinery FPC Cutting Machine ,CWVC-5S
PCB FPC Laser Separator PCB Punch Depanel Machinery FPC Cutting Machine ,CWVC-5S

PCB FPC Laser Separator PCB Punch Depanel Machinery FPC Cutting Machine ,CWVC-5S

  • Product description: PCB FPC Laser Separator PCB Punch Depanel Machinery FPC Cutting Machine ,CWVC-5S
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PCB FPC Laser Separator PCB Punch Depanel Machinery FPC Cutting Machine ,CWVC-5S


Specification:

Laser class

1

Max. working area (X x Y x Z)

300 mm x 300 mm x 11 mm

Max. recognition area (X x Y)

300 mm x 300 mm

Max. material size (X x Y)

350 mm x 350 mm

Data input formats

Gerber, X-Gerber, DXF, HPGL,

Max. structuring speed

Depends on application

Positioning accuracy

± 25 μm (1 Mil)

Diameter of focused laser beam

20 μm (0.8 Mil)

Laser wavelength

355 nm

System dimensions (W x H x D)

1000mm*940mm
*1520 mm

Weight

~ 450 kg (990 lbs)

Power supply

230 VAC, 50-60 Hz, 3 kVA

Cooling

Air-cooled (internal water-air cooling)

Ambient temperature

22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm
(71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil)

Humidity

< 60 % (non-condensing)

Required accessoires

Exhaust unit



Key Features:

*      *Pre-camera vision product position registration and model check

·      *  Coherent Avia NX UV laser with HurrySCAN head

·      *    High capacity BOFA dust collector

·      *  User friendly Window based software

·      *    PCB flexible product jig adjustable for different board size

·      *   High resolution and accurate Z stage with auto-focus function

·      *   Large area low friction front loading platform for sliding multiple product jigs

·      *  Fully covered class 1 safety enclosure

·      *   Able to do cutting and marking together

·      *  Compact size


Description:

PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.


Working principle :


Cutting Application:

FPC and some relative materials;

FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting;


Advantages:

No       No mechanical stress on substrates or circuits

           No tooling cost or consumables.

·         Versatility – ability to change applications by simply changing settings

·         Fiducial Recognition – more precise and clean cut

·         Optical Recognition before PCB depaneling/singulation process begins.

·         Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)

·         Extraordinary cut quality holding tolerances as small as < 50 microns.

·         No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards


Package:



CE Approval:



Customer List:

CONTACT US

Contact: Doreen

Phone: 13537348526 (Skype:s2@smtfly.com)

Tel: 86-0755-33581320

Email: s2@smtfly.com

Add: Building 2, Gang Hua Xing Industrial Park, Chongqing Road, Fuyong Town, Shenzhen, China 518103