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  • PCB Laser Separator Machine ,CWVC-5S
PCB Laser Separator Machine ,CWVC-5S

PCB Laser Separator Machine ,CWVC-5S

  • Product description: PCB Laser Separator Machine,CWVC-5S
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PCB Laser Separator Machine,CWVC-5S



Features:

1.High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries.

2.Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;

3.Reduce energy consumption, Cost savings.

Cost-effective, fast cutting speed, stable performance


Specification:

Laser class

1

Max. working area (X x Y x Z)

300 mm x 300 mm x 11 mm

Max. recognition area (X x Y)

300 mm x 300 mm

Max. material size (X x Y)

350 mm x 350 mm

Data input formats

Gerber, X-Gerber, DXF, HPGL,

Max. structuring speed

Depends on application

Positioning accuracy

± 25 μm (1 Mil)

Diameter of focused laser beam

20 μm (0.8 Mil)

Laser wavelength

355 nm

System dimensions (W x H x D)

1000mm*940mm
*1520 mm

Weight

~ 450 kg (990 lbs)

Power supply

230 VAC, 50-60 Hz, 3 kVA

Cooling

Air-cooled (internal water-air cooling)

Ambient temperature

22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm
(71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil)

Humidity

< 60 % (non-condensing)

Required accessoires

Exhaust unit


 Working Process:



Description:

PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.



Working principle :

humidity sensor ( humidity and temperature signal ) → Microcomputer ( CPU Central Processing Unit ) → Heaters  ( PTC heating module polymer material heating ) → Smart shape memory alloy ( alloy shape with temperature change ) → Balance spring ( general balance spring with alloy )


Cutting Application:

FPC and some relative materials;

FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting;



Advantages:

·        * Auto vision positioning

·        *Cost saving – no consumables and die wear

·        * Able to cut odd, complex and micro shape section out of PCBs

·        * No mechanical stress on product

·        * Quick model change turnaround time

·        * Excellent cut finish



Package:



CE Approval:



CONTACT US

Contact: Doreen

Phone: 13537348526 (Skype:s2@smtfly.com)

Tel: 86-0755-33581320

Email: s2@smtfly.com

Add: Building 2, Gang Hua Xing Industrial Park, Chongqing Road, Fuyong Town, Shenzhen, China 518103