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HSC Tin Auto Bonding Machine,CWPP-3A
HSC Tin Auto Bonding Machine,CWPP-3A Feature:
1. According to different products, optional temperature for your choice.12. Touch screen input data, simplify the operation.
HSC Tin Auto Bonding Machine,CWPP-3A Technical Parameters:
HSC Tin Auto Bonding Machine,CWPP-3A Application:
. For a variety of high density TAB, TCP crimping and FPC, FFC and PCB solder crimp.
HSC Tin Auto Bonding Machine,CWPP-3A Part of Product:
HSC Tin Auto Bonding Machine,CWPP-3A Our Service:
# 1 day delivery
# 24 hours fast response
# Largest manufactory in South China
# 100% responsible for quality
# 14 years experience
Contact: Doreen
Phone: 13537348526 (Skype:s2@smtfly.com)
Tel: 86-0755-33581320
Email: s2@smtfly.com
Add: Building 2, Gang Hua Xing Industrial Park, Chongqing Road, Fuyong Town, Shenzhen, China 518103